An integrated circuit (IC) hardware design engineer at the UNLV Howard R. Hughes College of Engineering is analyzing electrostatic charge accumulation on a high-speed microprocessor silicon die. The microscopic planar capacitor plate occupies a rectangular footprint:
R=[0,3]×[0,2](units in millimeters)
During chemical-mechanical planarization (CMP) and high-density ion implantation, dopant dispersion produces an oscillatory non-uniform surface charge density across the die:
σ(x,y)=5xycos(x2y)(nC/mm2)
where
x and
y are spatial coordinates on the die face.
Step-by-Step Solution:
State the Governing Double Integral Formulation:
State the Surface Charge Accumulation Formula (defined in Double Integrals over a Rectangular Region):
Q=∬Rσ(x,y)dA
Select the Strategically Optimal Order of Integration:
Under Fubini's Theorem, the integral can be formulated in either order:
- If integrating dydx, the inner integral is ∫5xycos(x2y)dy, requiring integration by parts because the derivative of the argument x2y with respect to y is x2, which does not match the exterior factor 5xy.
- If integrating dxdy, the inner integral is ∫5xycos(x2y)dx. Here, ∂x∂(x2y)=2xy, which matches the exterior multiplier xy up to a scalar constant, allowing direct single-step u-substitution!
Therefore, we set up the iterated integral as dxdy:
Q=∫02∫035xycos(x2y)dxdy
Evaluate the Inner Integral (dx):
Hold y constant and use substitution:
Let u=x2y⟹∂x∂u=2xy⟹xydx=2du
Convert limits for x:
At x=0⟹u=0
At x=3⟹u=(3)2y=9y
Substitute into the inner integral:
∫035xycos(x2y)dx=∫09y5cos(u)2du=25[sin(u)]09y=25sin(9y)
Evaluate the Outer Integral (dy):
Q=∫0225sin(9y)dy=25[−91cos(9y)]02=−185[cos(9y)]02
=−185(cos(18)−cos(0))=−185(cos(18)−1)=185(1−cos(18))
Note that the argument 18 is in radians. Using cos(18 rad)≈0.660317:
Q=185(1−0.660317)=185(0.339683)≈0.09436 nC
Meaning of the Answer & Real-Life Application:
- Quantitative Interpretation: The total net stored electrostatic charge is Q=185(1−cos(18)) nC≈0.0944 nC (94.4 pC). The alternating harmonic behavior of cos(x2y) produces localized positive and negative charge pockets across the die surface that partially cancel, leaving a modest residual positive net charge.
- Engineering Application: In sub-micron semiconductor manufacturing, parasitic capacitive charge changes the gate switching delay τ=RCparasitic. Computer and electrical engineers model surface charge accumulations via double integrals to design on-chip electrostatic discharge (ESD) protection clamp circuits and verify signal timing margins in clock distribution trees.