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Microprocessor Heat Sink Volumetric Thermal Dissipation (Computer & Mechanical Engineering) Solution

Formulas & Definitions

A computer systems thermal architect at the UNLV Howard R. Hughes College of Engineering is designing a high-conductivity copper heat-spreader block mounted directly above an enterprise artificial intelligence (AI) accelerator microprocessor.

The heat-spreader block occupies a 3D rectangular box domain in centimeters:

B=[0,4]×[0,4]×[0,2]B = [0, 4] \times [0, 4] \times [0, 2]B=[0,4]×[0,4]×[0,2]
with volumetric thermal power generation q(x,y,z)=3x2yz W/cm3q(x, y, z) = 3x^2 y z\text{ W/cm}^3q(x,y,z)=3x2yz W/cm3.

Step-by-Step Solution:

  1. Calculate Geometric Volume:
    State the Volume of a Rectangular Box Formula (defined in Triple Integrals over a Rectangular Region):

    V(B)=(b−a)(d−c)(s−r)V(B) = (b - a)(d - c)(s - r)V(B)=(b−a)(d−c)(s−r)
    Substitute the domain limits:
    V(B)=(4−0)(4−0)(2−0)=4×4×2=32 cm3V(B) = (4 - 0)(4 - 0)(2 - 0) = 4 \times 4 \times 2 = 32\text{ cm}^3V(B)=(4−0)(4−0)(2−0)=4×4×2=32 cm3

  2. Set Up the Triple Integral for Total Heat Dissipation:
    State the Total Quantity Accumulation Formula via Triple Integration:

    Ptotal=∭Bq(x,y,z) dVP_{\text{total}} = \iiint_{B} q(x, y, z) \, dVPtotal​=∭B​q(x,y,z)dV
    Using the differential volume element dV=dz dy dxdV = dz \, dy \, dxdV=dzdydx:
    Ptotal=∫04∫04∫023x2yz dz dy dxP_{\text{total}} = \int_{0}^{4} \int_{0}^{4} \int_{0}^{2} 3x^2 y z \, dz \, dy \, dxPtotal​=∫04​∫04​∫02​3x2yzdzdydx

  3. Evaluate the Triple Integral:
    Because the integrand is algebraically separable and the boundaries are constants, apply Separability for Triple Integrals over Rectangular Boxes:

    Ptotal=3(∫04x2 dx)(∫04y dy)(∫02z dz)P_{\text{total}} = 3 \left( \int_{0}^{4} x^2 \, dx \right) \left( \int_{0}^{4} y \, dy \right) \left( \int_{0}^{2} z \, dz \right)Ptotal​=3(∫04​x2dx)(∫04​ydy)(∫02​zdz)

    Evaluate the xxx-integral:

    ∫04x2 dx=[x33]04=643−0=643\int_{0}^{4} x^2 \, dx = \left[ \frac{x^3}{3} \right]_{0}^{4} = \frac{64}{3} - 0 = \frac{64}{3}∫04​x2dx=[3x3​]04​=364​−0=364​

    Evaluate the yyy-integral:

    ∫04y dy=[y22]04=162−0=8\int_{0}^{4} y \, dy = \left[ \frac{y^2}{2} \right]_{0}^{4} = \frac{16}{2} - 0 = 8∫04​ydy=[2y2​]04​=216​−0=8

    Evaluate the zzz-integral:

    ∫02z dz=[z22]02=42−0=2\int_{0}^{2} z \, dz = \left[ \frac{z^2}{2} \right]_{0}^{2} = \frac{4}{2} - 0 = 2∫02​zdz=[2z2​]02​=24​−0=2

    Multiply the evaluated factors:

    Ptotal=3×(643)×8×2=64×16=1024 WP_{\text{total}} = 3 \times \left(\frac{64}{3}\right) \times 8 \times 2 = 64 \times 16 = 1024\text{ W}Ptotal​=3×(364​)×8×2=64×16=1024 W

  4. Compute Average Volumetric Generation Rate:
    State the Average Value Formula for a 3D Function:

    q‾=1V(B)∭Bq(x,y,z) dV=PtotalV(B)\overline{q} = \frac{1}{V(B)} \iiint_{B} q(x, y, z) \, dV = \frac{P_{\text{total}}}{V(B)}q​=V(B)1​∭B​q(x,y,z)dV=V(B)Ptotal​​
    Substitute the calculated values:
    q‾=1024 W32 cm3=32 W/cm3\overline{q} = \frac{1024\text{ W}}{32\text{ cm}^3} = 32\text{ W/cm}^3q​=32 cm31024 W​=32 W/cm3

Meaning of the Answer & Real-Life Application:

  • Quantitative Interpretation: The total heat generation rate across the copper spreader block is 1024 W1024\text{ W}1024 W (approximately 1.024 kW1.024\text{ kW}1.024 kW), with an average volumetric energy density of 32 W/cm332\text{ W/cm}^332 W/cm3.
  • Engineering Application: In data-center thermal management, an instantaneous heat load of over 1 kW1\text{ kW}1 kW concentrated on a 4 cm×4 cm4\text{ cm} \times 4\text{ cm}4 cm×4 cm footprint represents extreme thermal flux (≈64 W/cm2\approx 64\text{ W/cm}^2≈64 W/cm2). Knowing the exact total thermal load allows cooling system engineers to size the coolant volumetric flow rate V˙=PtotalρcpΔT\dot{V} = \frac{P_{\text{total}}}{\rho c_p \Delta T}V˙=ρcp​ΔTPtotal​​ in a pumped liquid cold plate to ensure the junction temperature TjT_jTj​ never exceeds the 85∘C85^\circ\text{C}85∘C silicon degradation threshold.