We analyze the temperature field T(x,y)=120−4x2−2y2 at sensor point P(2,3). We evaluate the gradient ∇T, find the maximum rate of change, establish the direction of steepest cooling (−∇T), determine constant-temperature tangent vectors, and link results to Fourier heat conduction in micro-channel heat sink design.
Step-by-Step Mathematical Solution
1. Compute Temperature Gradient and Maximum Rate of Increase
Compute the maximum instantaneous rate of temperature increase:
∥∇T(2,3)∥=(−16)2+(−12)2=256+144=400=20∘C/mm
2. Direction of Steepest Cooling (Steepest Descent)
The direction of most rapid temperature drop is strictly opposite to the gradient vector:
vcool=−∇T(2,3)=−⟨−16,−12⟩=⟨16,12⟩
Normalize to obtain the unit vector direction ucool:
∥vcool∥=20
ucool=20⟨16,12⟩=⟨54,53⟩=⟨0.8,0.6⟩
Moving along unit heading ⟨0.8,0.6⟩ yields the steepest temperature drop at rate −∥∇T∥=−20∘C/mm.
3. Directions of Zero Temperature Change (Isothermal Tangents)
Zero change in temperature occurs in directions orthogonal to ∇T=⟨−16,−12⟩. For any 2D vector ⟨a,b⟩, orthogonal vectors are given by ⟨−b,a⟩ and ⟨b,−a⟩:
w1=⟨12,−16⟩,w2=⟨−12,16⟩
Normalize to unit vectors:
∥w1∥=122+(−16)2=20
uiso,1=⟨2012,−2016⟩=⟨53,−54⟩=⟨0.6,−0.8⟩
uiso,2=−uiso,1=⟨−53,54⟩=⟨−0.6,0.8⟩
Moving along either uiso,1 or uiso,2 yields DuT=0∘C/mm.
4. Fourier's Law & Heat Sink Channel Alignment
Thermodynamic Basis: Conductive heat flow obeys Fourier's Law: q=−k∇T. Because −k<0, heat flux flows strictly in the direction of steepest cooling (−∇T=⟨16,12⟩).
Engineering Impact: Orienting liquid micro-channels or copper cooling fins parallel to ucool=⟨0.8,0.6⟩ aligns the coolant path with the natural thermal conduction vector. This maximizes the convective heat transfer coefficient, prevents local hotspot accumulation, and minimizes thermal stresses that cause silicon fracture.